Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the

Commodity

Commodity Code

845610

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Commodity group

• Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof 84
  • Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning appa 8456
    • Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the 845610
      • Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) 84561000
      • M/c tools operated by laser or other light,of a kind used in the mfr of semicon wafers or devices 84561010
      • Other m/c tools operated by laser or other light other than of a kind used in the mfr of semicon wafers 84561090
    • Machine tools for working any material by removal of material, operated by laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or o 845611
    • Machine tools for working any material by removal of material, operated by light or photon beam processes other than laser (excl. soldering and welding machines, also those which can be used for cutting, material testing machines and machines for the 845612
    • Machine tools for working any material by removal of material, operated by ultrasonic processes (excl. cleaning apparatus operated by ultrasonic processes and material testing machines) 845620
    • Machine tools for working any material by removal of material, operated by electro-discharge processes 845630
    • Machine tools for working any material by removal of material, operated by plasma arc processes 845640
    • Water-jet cutting machines 845650
    • Machine tools for working any material by removal of material, operated by electro-chemical, electron beam or ionic-beam processes (excl. soldering and welding machines, material testing machines and machines for the manufacture of semiconductor devi 845690
    • Apparatus for dry-etching patterns on semiconductor materials   845691
    • Machine-tools for working any material by removal of material, operated by electro-chemical processes or electron beam, ion beam or plasma arc processes (excl. for soldering and welding machines, materials testing machines and apparatus for-dry etchi 845699