Other m/c tools operated by laser or other light other than of a kind used in the mfr of semicon wafers

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Nuclear reactors, boilers, machinery and mechanical appliances; parts thereof Commodity code: 84
- Machine tools for working any material by removal of material, by laser or other light or photon beam, ultrasonic, electro-discharge, electro-chemical, electron beam, ionic-beam or plasma arc processes; water-jet cutting machines (excl. cleaning appa Commodity code: 84 56
  - Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the Commodity code: 84 56 10
    - Other m/c tools operated by laser or other light other than of a kind used in the mfr of semicon wafers Commodity code: 84 56 10 90
    - Machine tools for working any material by removal of material, operated by laser or other light or photon beam processes (excl. soldering and welding machines, incl. those which can be used for cutting, material testing machines and machines for the manufacture of semiconductor devices or of electronic integrated circuits) Commodity code: 84 56 10 00
    - M/c tools operated by laser or other light,of a kind used in the mfr of semicon wafers or devices Commodity code: 84 56 10 10